250ml of Immersion Tin Solution. This Immersion Tin process (Ormecon CSN7001) provides fast efficient tinning of copper PCB's; a single dip at room temperature produces bright tinning in seconds. When used after copper polish, this tin process will result in board with an ultra bright mirror finish - a 30cm deep shine! This leaves a highly solderable anti oxidising finish.
500ml of Immersion Tin Solution. This Immersion Tin process (Ormecon CSN7001) provides fast efficient tinning of copper PCB's; a single dip at room temperature produces bright tinning in seconds. When used after copper polish, this tin process will result in board with an ultra bright mirror finish - a 30cm deep shine! This leaves a highly solderable anti oxidising finish.
Immersion Copper Polish Part A 100ml. This process is designed to quickly polish copper clad PCB boards, producing a deep mirror shine without abrasion. This process produces an ideal base for the Immersion Tin Process
Immersion Copper Polish Part A 200ml. This process is designed to quickly polish copper clad PCB boards, producing a deep mirror shine without abrasion. This process produces an ideal base for the Immersion Tin Process
Immersion Copper Polish Part B 250ml. This process is designed to quickly polish copper clad PCB boards, producing a deep mirror shine without abrasion. This process produces an ideal base for the Immersion Tin Process
Immersion Copper Polish Part B 500ml. This process is designed to quickly polish copper clad PCB boards, producing a deep mirror shine without abrasion. This process produces an ideal base for the Immersion Tin Process
