DuPont™ Pyralux® AG is a double-sided copper-clad laminate featuring an adhesive-less, all-polyimide dielectric layer. This material system is ideal for low layer count flexible printed circuits that require advanced material performance, excellent temperature resistance, and high reliability. Offered in a variety of both dielectric and conductor thickness, DuPont™ Pyralux® AG provides designers, fabricators, and assemblers a versatile option for a wide variety of flexible circuit constructions.
Key Features and Benefits • Strong dielectric to Cu bond strength affords high reliability • Excellent thermal resistance from all-polyimide dielectric • Minimal variance in dielectric thickness for consistent circuitry performance • Pass UL 94 test. UL File number is E161336 • RoHS Compliant