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Part Number: 02061
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The Immersion Tin process uses and ion displacement reaction to plate the circuit board surface. When the surface metal finish (tin) has been deposited, the source of electrons is used up and the process is complete. The process is self-limiting because the copper forms an inter-metallic layer that inhibits the immersion reaction.
If this tin process is used after the Copper Polish Process it results in a board with an ultra bright mirror finish (a 30cm+ shine). This leaves a highly solderable anti-oxidizing finish. Working with modern solders can now be an effortless task with this fast wetting easy flowing finish.
This Immersion tin process provides fast efficient tinning of copper PCB's; a single dip at room temperature produces bright tinning in seconds.